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this is information on a product in full production. august 2014 docid025079 rev 2 1/17 ECMF02-2HSMX6 esd protected common mode filter for usb3.0 interface datasheet - production data figure 1. pin out, top view features ? high common mode attenuation: ? -10 db @ 300 mhz ? -20 db @ 2.4 and 5 ghz ? -15 db from 500 mhz to 6 ghz ? compliant with usb3.0 eye diagram ? small and thin package 1.5 x 1.7 x 0.5 mm ? rohs compliant. ? high reduction of parasitic elements through integration. ? esd protection compliant with iec 61000-4-2 level 4 standards (8 kv contact) benefits ? suppress the common mode noise but keep signal integrity ? low pcb space consumption. ? save components count ? make the application robust against esd strikes from external environment description the ECMF02-2HSMX6 is a highly integrated common mode filter designed to suppress emi/rfi common mode noise on high speed differential serial buses like the usb3.0 transceiver. applications consumer and computer electronics featuring usb3.0 such as: ? personal computer ? notebook ? tablet ? set-top boxes ? pc graphic cards ? telecom application qfn-6l 1.7 x 1.5 mm 1 2 3 6 5 4 d+ connector d- connector gnd to be left floating d+ ic d- ic www.st.com
functional description ECMF02-2HSMX6 2/17 docid025079 rev 2 1 functional description the ECMF02-2HSMX6 is an esd protected common mode filter especially designed for usb3.0 tx/rx differential pair, for host and device. the usb3.0 is actually made of 3 differential pairs. the first differential pair supports the high speed usb mode (also called usb2.0 mode). the 2 other differential pairs are used to support the super speed usb mode in full duplex. bit rate on super speed usb can reach 5 gbps. the ECMF02-2HSMX6 is able to filter the common mode noise from 300 mhz to 6 ghz, helping to make the application compliant with the electromagnetic interference emission standard such as cispr22 or fcc part 15, or en55022 and avoiding antenna desense on mobile phones, wifi/bluetooth, gps,/gnss frequencies. at the same time, the ECMF02-2HSMX6 keeps the high speed signal integrity and provides an efficient esd protection. more application information available in following an: ? application note an4356: "antenna desense on handheld equipment" ? application note an4511: "common mode filters" ? application note an4540: "mhl link filtering and protection" figure 2. functional diagram a typical application diagram is shown in figure 3 . st offers a global approach to usb3.0 interface by providing a comprehensive range of dedicated products. 2 1 3 6 4 5 d+ connector d- connector gnd to be left floating d+ ic d- ic
docid025079 rev 2 3/17 ECMF02-2HSMX6 functional description 17 figure 3. typical application diagram usb 3.0 super speed driver usb 2.0 high speed driver v bus d+ d- gnd sstx+ usb 2.0 high speed driver usb 3.0 cable v bus d+ d- gnd + + usb 3.0 super speed driver + + host sstx - ssrx+ ssrx - connector hub/device sstx+ sstx - ssrx+ ssrx - connector d+ d- d- gnd v bus gnd i d d+ d+ d- d- gnd v bus gnd i d d+ d+ d- d- gnd i d d+ 2 61 3 4 5 d+ d- d- gnd i d d+ 2 61 3 4 5 d+ d- d- gnd i d d+ 2 1 3 6 4 5 d+ d- d- gnd i d d+ 2 1 3 6 4 5 ECMF02-2HSMX6 ECMF02-2HSMX6 ECMF02-2HSMX6 ECMF02-2HSMX6 ecmf02-4cmx8 ecmf02-4cmx8
electrical characteristics ECMF02-2HSMX6 4/17 docid025079 rev 2 2 electrical characteristics figure 4. electrical characteristics (definitions) table 1. absolute maximum ratings (limiting values) symbol parameter test conditions value. unit v pp esd discharge (pins 1 and 2) iec 61000-4-2 level 4 contact discharge 8 kv air discharge 15 kv i dc maximum dc current 100 ma t op operating temperature range -40 to 85 c t j maximum junction temperature 125 c t stg storage temperature range -55 to +150 c table 2. electrical characteristics (t amb = 25 c) symbol parameter test conditions min. typ. max. unit v br breakdown voltage i r = 1 ma 6 v i rm reverse leakage v rm = 3 v 100 na r dc dc serial resistance 7 9 symbol parameter v = breakdown voltage i = leakage current @ v v = stand-off voltage v = clamping voltage at i pp i = peak pulse current br rm rm rm cl pp v i v cl v br v rm i f v f i i rm r i pp i = forward current f v = forward voltage f
docid025079 rev 2 5/17 ECMF02-2HSMX6 electrical characteristics 17 figure 5 shows that usb3.0 devices and cables can interfere with radio frequency devices operating between 700 mhz and 5 ghz. figure 5. usb3.0 frequency radiation measured with current loop figure 6. differential attenuation versus frequency -100 -95 -90 -85 -80 -75 -70 0 0,5 1 1,5 2 2,5 3 3,5 4 4,5 5 5,5 6 frequency (ghz) skew db 10m 30m 100m 300m 1g 3g -5 -4 -3 -2 -1 0 sdd21 (db) f 0 @-3 db = 3.2 ghz f (hz)
electrical characteristics ECMF02-2HSMX6 6/17 docid025079 rev 2 figure 7. common mode attenuation versus frequency note: stmicroelectronics has defined the usb3.0 scc21 template to prevent antenna desense between 700 mhz and 5 ghz. figure 8. return loss versus frequency (z 0 com = 50 - sdd11) 10m 30m 100m 300m 1g 3g -40 -35 -30 -25 -20 -15 -10 -5 0 scc21 (db) f (hz) usb3.0 s21cc template 10m 30m 100m 300m 1g 3g - 40 -35 -30 -25 -20 -15 -10 -5 0 sdd11 (db) f (hz)
docid025079 rev 2 7/17 ECMF02-2HSMX6 electrical characteristics 17 figure 9. return loss versus frequency (z 0 com = 50 - sdd22) figure 10. differential (z dd21 ) and common mode (z cc21 ) impedance versus frequency 10m 30m 100m 300m 1g 3g -40 -35 -30 -25 -20 -15 -10 -5 0 sdd22 (db) f (hz) 1e7 1e8 1e9 6e9 1e1 1e2 1e3 1e4 z dd21 z cc21 () f (hz)
electrical characteristics ECMF02-2HSMX6 8/17 docid025079 rev 2 figure 11. typical esd response to iec 61000-4-2 +8kv contact figure 12. typical esd response to iec 61000-4-2 -8kv contact 10 v/div 20 ns/div v : esd peak voltage pp v :clamping voltage @ 30 ns cl v :clamping voltage @ 60 ns cl v :clamping voltage @ 100 ns cl 1 2 3 4 56.4 v 26.8 v 19.0 v 12.5 v 1 2 4 3 10 v/div -60.2 v -16.0 v -9.9 v -6.4 v 20 ns/div 1 2 4 v : esd peak voltage pp v :clamping voltage @ 30 ns cl v :clamping voltage @ 60 ns cl v :clamping voltage @ 100 ns cl 1 2 3 4 3
docid025079 rev 2 9/17 ECMF02-2HSMX6 electrical characteristics 17 figure 13. usb2.0 (480 mbps) eye diagram without device figure 14. usb2.0 (480 mbps) eye diagram with device figure 15. usb3.0 (5 gbps) eye diagram without device figure 16. usb3.0 (5 gbps) eye diagram with device figure 17. usb3.1 (10 gbps) eye diagram without device figure 18. usb3.1 (10 gbps) eye diagram with device
electrical characteristics ECMF02-2HSMX6 10/17 docid025079 rev 2 figure 19. mhl (4.5 gbps) eye diagram without device figure 20. mhl (4.5 gbps) eye diagram with device figure 21. mhl (6 gbps) eye diagram without device figure 22. mhl (6 gbps) eye diagram with device figure 23. display port hbr2 (5.4 gbps) eye diagram without device figure 24. display port hbr2 (5.4 gbps) eye diagram with device
docid025079 rev 2 11/17 ECMF02-2HSMX6 package information 17 3 package information ? epoxy meets ul94, v0 ? lead-free package in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com . ecopack ? is an st trademark. figure 25. qfn-6l di mension definitions table 3. qfn-6l dimension values ref. dimensions millimeters inches min. typ. max. min. typ. max. a 0.45 0.50 0.55 0.018 0.020 0.022 a1 0.00 0.02 0.05 0.000 0.001 0.002 b 0.15 0.20 0.25 0.006 0.008 0.010 d 1.55 1.60 1.65 0.061 0.063 0.065 e 1.30 1.35 1.40 0.051 0.053 0.055 e 0.45 0.50 0.55 0.018 0.020 0.022 l1 0.35 0.45 0.55 0.014 0.018 0.022 l2 0.65 0.75 0.85 0.026 0.030 0.034 d index area top view side view bottom view e a e l2 l1 b a1 pin # 1 id 1 6 3 4
package information ECMF02-2HSMX6 12/17 docid025079 rev 2 figure 28. tape and reel specifications figure 26. footprint, dimensions in mm (inches) figure 27. marking 0.25 (0.0098) 0.50 (0.0197) 0.30 (0.0118) 0.95 (0.0374) 0.65 (0.0256) x y x w z w dot, xx = marking z = manufacturing location yww = datecode (y = year ww = week) dot identifying pin a1 location user direction of unreeling all dimensions are typical values in mm 4.0 4.0 2.0 8.0 1.75 3.5 ? 1.55 0.75 1.63 0.22 1.85 xxx yww xxx yww xxx yww
docid025079 rev 2 13/17 ECMF02-2HSMX6 recommendation on pcb assembly 17 4 recommendation on pcb assembly 4.1 stencil opening design 1. general recommendation on stencil opening design a) stencil opening dimensions: l (length), w (width), t (thickness). figure 29. stencil opening dimensions b) general design rule stencil thickness (t) = 75 ~ 125 m 2. reference design a) stencil opening thickness: 100 m b) stencil opening for leads: opening to footprint ratio is 90%. 4.2 solder paste 1. use halide-free flux, qualification rol0 according to ansi/j-std-004. 2. ?no clean? solder paste recommended. 3. offers a high tack force to resist component displacement during pcb movement. 4. use solder paste with fine particles: powder particle size 20-45 m. l t w aspect ratio w t ----- 1.5 = aspect area lw 2t l w + () --------------------------- - 0.66 =
recommendation on pcb assembly ECMF02-2HSMX6 14/17 docid025079 rev 2 figure 30. recommended stencil window position 4.3 placement 1. manual positioning is not recommended. 2. it is recommended to use the lead recognition capabilities of the placement system, not the outline centering. 3. standard tolerance of 0.05 mm is recommended. 4. 3.5 n placement force is recommended. too much placement force can lead to squeezed out solder paste and cause solder joints to short. too low placement force can lead to insufficient contact between package and solder paste that could cause open solder joints or badly centered packages. 5. to improve the package placement accuracy, a bottom side optical control should be performed with a high resolution tool. 6. for assembly, a perfect supporting of the pcb (all the more on flexible pcb) is recommended during solder paste printing, pick and place and reflow soldering by using optimized tools. 4.4 pcb design preference 1. to control the solder paste amount, the closed via is recommended instead of open vias. 2. the position of tracks and open vias in the solder area should be well balanced. the symmetrical layout is recommended, in case any tilt phenomena caused by asymmetrical solder paste amount due to the solder flow away. 0.25 (0.0098) 0.50 (0.0197) 0.30 (0.0118) 0.95 (0.0374) 0.65 (0.0256) 0.34 (0.0134) 0.90 (0.0354) 0.62 (0.0244) 0.24 (0.0095) 0.50 (0.0197) mm (inches) stencil window footprint
docid025079 rev 2 15/17 ECMF02-2HSMX6 recommendation on pcb assembly 17 4.5 reflow profile figure 31. st ecopack ? recommended soldering reflow profile for pcb mounting note: minimize air convection currents in the reflow oven to avoid component movement. 4.6 pcb layout recommendation figure 32. pcb footprint recommendation 250 0 50 100 150 200 240 210 180 150 120 90 60 30 300 270 - 6c/s 240-245 c 2 - 3 c/s temperature (c) -2 c/s -3 c/s time (s) 0.9 c/s 60 sec (90 max) zdiff according to the application via to gnd plane
ordering information ECMF02-2HSMX6 16/17 docid025079 rev 2 5 ordering information figure 33. ordering information scheme 6 revision history table 4. ordering information order code marking package weight base qty delivery mode ECMF02-2HSMX6 kr qfn-6l 3.4 mg 3000 tape and reel ecmf 02 - 2 hs mx6 function esd common mode filter number of lines 02 = 2 lines number of esd protected lines 2 = 2 esd protected lines version hs = high speed lines package mx6 = qfn-6l table 5. document revision history date revision changes 13-nov-2013 1 initial release. 25-aug-2014 2 inserted figure 10: differential (zdd21) and common mode (zcc21) impedance versus frequency .
docid025079 rev 2 17/17 ECMF02-2HSMX6 17 important notice ? please read carefully stmicroelectronics nv and its subsidiaries (?st?) reserve the right to make changes, corrections, enhancements, modifications, and improvements to st products and/or to this document at any time without notice. purchasers should obtain the latest relevant in formation on st products before placing orders. st products are sold pursuant to st?s terms and conditions of sale in place at the time of o rder acknowledgement. purchasers are solely responsible for the choice, selection, and use of st products and st assumes no liability for application assistance or the design of purchasers? products. no license, express or implied, to any intellectual property right is granted by st herein. resale of st products with provisions different from the information set forth herein shall void any warranty granted by st for such product. st and the st logo are trademarks of st. all other product or service names are the property of their respective owners. information in this document supersedes and replaces information previously supplied in any prior versions of this document. ? 2014 stmicroelectronics ? all rights reserved

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